Qualcomm introduces the Snapdragon 865 Plus 5G with performance and connectivity improvements

The Snapdragon 865 Plus 5G mobile chipset will be the new top of the range of the Qualcomm catalog. A development based on the current Snapdragon 865 that will break the 3 GHz barrier in working frequency and will offer support for Wi-Fi 6E as main novelties.

Snapdragon 865 Plus 5G will be manufactured by TSMC foundry in 7 nanometer technological processes. It has an eight-core Kryo 585 CPU, with a main Cortex A77 that will work at 3.1 GHz. The rest of the cores maintain the same clock speed as the 865, three additional Cortex A77 cores at 2.42 GHz and another four Cortex A55 cores with a 1.8 GHz frequency to perform less power tasks and increase autonomy.

It is the first time that Qualcomm and any other provider overcomes the 3 GHz barrier in a mobile SoC and this is enough to increase the overall performance by 10% over the previous model. The built-in GPU is known, an Adreno 650 that has also been boosted in working frequency to deliver another 10% performance boost.

Among the great novelties of the Snapdragon 865 Plus 5G stands out FastConnect 6900, a new mobile connectivity system that offers support for Wi-Fi 6E. It is the latest wireless standard from the Wi-Fi Alliance and stands out for the use of the 6 GHz band in addition to the existing 2.4 GHz and 5 GHz bands. Qualcomm promises (impressive) speeds of up to 3.6 Gbps, reduced latency for VR and also support for Bluetooth 5.2.

The rest of the components remain unchanged compared to the standard 865, the Hexagon digital signal processor, the Spectra image processor or Qualcomm’s fifth generation Artificial Intelligence engine. Of course, the 5G support with the Snapdragon X55 and all the mobile gaming technologies that the firm frames within the Snapdragon Elite Gaming platform, running titles with a frame rate of up to 144 FPS, HDR 10-bit, Qualcomm aptX audio and on screens up to 4K with a refresh rate of 120 Hz.

Snapdragon 865 Plus 5G, specifications

  • Snapdragon 865+ 5G – Manufacture by TSMC at 7nm
  • Kryo 585 eight-core CPU. 1 Cortex A77 at 3.1 GHz – 3 Cortex A77 at 2.42 GHz – 4 Cortex A55 at 1.8 GHz.
  • Adreno 650 GPU with a frequency higher than 600 GHz
  • DSP Hexagon 698
  • ISP Spectra 480
  • Fifth generation AI engine
  • Connectivity: FastConnect 6900 with Wi-Fi 6E and Bluetooth 5.2
  • Network connectivity: Snapdragon X55 – 5G R Sub-6 + mmWave- LTE Category 24/22
  • Cameras: Sensors up to 200 MP and 4K video
  • Screens: 8K30 – 4K120 – Dolby Vision, HDR10 +, HDR10, HLG
  • Qualcomm aptX audio
  • RAM memory: LPDDR5 (2750 MHz) and LPDDR4 (2133 MHz)

Snapdragon 865 Plus 5G will debut on the third quarter of 2020. We will see it on smartphones like the ASUS ROG Phone 3 or the Lenovo Legion. And many more for manufacturers who want to use the most advanced mobile chipset on the market among what is available for OEMs, since the only alternative at this level of maximum performance for mobile phones can come from the Apple A and that is exclusive to iPhones.






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